For PCB Power Supply Uses a New Power Supply Operation and Monitor Circuit, Redundancy, assures Reliable Operation for Power Supply. With Reference to the International Advanced Design Technology, Output Waveform Neat, Smooth, Can Effectively Improve Plating Layer Uniformity.

 

With the increasing complexity, thickness and path density of PCB boards, as well as the decreasing aperture and path width, traditional DC electroplating is becoming less and less effective. DC electroplating technology is difficult to provide high speed electroplating and even electroplating distribution for these products. This is mainly due to the fact that copper ions are distributed in the edge part of the hole, i.e. the field of high current density, rather than in the center part of the hole, i.e. the field of low current density. As a result, copper ions are distributed more in the edge part of the hole than in the center part of the hole. The positive and negative pulse power supply regulates the aggregation and distribution of copper ions in the field of high and low current density through the action of pulse.

 

DC output current: 50A ~ 5000A

DC output voltage: 3V ~ 36V optional

Cooling mode: air cooling